Our facility operates a high-density computing hall for financial modeling, where traditional air cooling was failing to prevent localized hotspots exceeding 50°C. Thermal Runaway Engineering designed and implemented a direct-to-chip liquid cooling retrofit for 200 server racks.
The system not only brought all component temperatures into the optimal 25-35°C range but also reduced our overall facility PUE from 1.45 to 1.18. The precision of their thermal modeling was remarkable—they predicted coolant flow rates and temperature differentials within a 2% margin of error. Their team managed the entire integration during our scheduled maintenance window with zero operational downtime.
This solution has directly extended the projected lifespan of our hardware and has given us the thermal headroom to increase compute density by 30% in the same footprint. The engineering documentation and real-time monitoring dashboard they provided are exceptional.